Gain Kim

Gain Kim (Senior Member, IEEE) received the B.Sc. and M.Sc. degrees in electrical engineering and the Ph.D. degree in microsystems and microelectronics from Ecole Polytechnique Federale de Lausanne (EPFL), Lausanne, Switzerland, in 2013, 2015, and 2018, respectively.

From September 2016 to July 2018, he was with the High-Speed Interconnect Technology Group, IBM Research Europe Zurich Laboratory, Ruschlikon, Switzerland. From 2018 to 2020, he was a post-doctoral fellow with Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea. From 2020 to 2022, he was with Samsung Electronics, Seoul, South Korea, as a Staff Engineer.

In 2022, he joined the Department of Electrical Engineering and Computer Science, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu, South Korea, as a faculty member, where he is currently an Associate Professor. His research interests include high-speed wireline transceivers, data converters, and DSP techniques for high-speed wireline.

Dr. Kim has been serving as a TPC Member of the IEEE CICC, Wireline Subcommittee, and the IEEE A-SSCC, Data Converter Subcommittee, Since 2025. He was a recipient of the 2018 IEEE Circuits and Systems Pre-Doctoral Scholarship Award.